smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 1/7 applications - temperature measurement and compensation for m obile phone applications (e.g. battery pack, tcxo, lcd display), automotive and data systems features - multilayer smd ntc with inner electrodes - standard eia chip size 0805 - ni - barrier termination (ag/ni/sn) - high accuracy: 5% in resistance, 3% in b-value - excellent long term ageing stability in hi gh temperature and high humidity environment - superior resistance stability during soldering, therefore almost no change (<1%) during soldering - the component is compliant with rohs (directive 2002/95/ec of the european parliament and the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment) part dimensions type l w t k 0805 2.0 0.20 1.25 0.15 1.30 max. 0.50 0.25 dimensions in mm electrical specifications part number zero-power resistance (at 25c) b 25/100 b 25/85 b 25/50 b57431v2472j062 100k ? 5% 4500 k 3% (4470 k) (4390 k) climatic category (iec 60068-1) 55/125/56 lower category temperature -55c higher category temperature 125c power rating at 25c p 25 210mw 1) dissipation factor (on pcb) g th approx. 3.5 mw/k 1) thermal cooling time constant (on pcb) t th approx. 10.0 s 1) heat capacity c th approx. 35 mj/k 1) weight of component approx. 13 mg 1) depends on mounting situation termination ag/ni/sn dimensions in [mm] w l t k
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 2/7 resistance - temperature characteristic ntc resistance temperature curve r/t-curve 8503 / a01 r at 25c 100000 [ohm] b(25/100) 4500[k] 3 [%] rn at 25c 100000 [ohm] 5 [%] t [c] r_nom [?] r_min [?] r_max [?] ? r/r25 [%] ? t [c] -55 13251642 10382025 16121259 21,7 2,8 -50 9052292 7217556 10887029 20,3 2,7 -45 6263714 5077217 7450210 18,9 2,6 -40 4386660 3611387 5161932 17,7 2,5 -35 3107081 2595726 3618436 16,5 2,4 -30 2224393 1884237 2564548 15,3 2,3 -25 1608658 1380657 1836659 14,2 2,2 -20 1174593 1020735 1328451 13,1 2,1 -15 865527 761093 969962 12,1 2,0 -10 643370 572134 714606 11,1 1,9 -5 482234 433452 531015 10,1 1,8 0 364348 330849 397847 9,2 1,7 5 277391 254352 300430 8,3 1,5 10 212741 196894 228587 7,4 1,4 15 164311 153431 175190 6,6 1,3 20 127767 120328 135206 5,8 1,2 25 100000 95000 105000 5,0 1,0 30 78759 74194 83325 5,8 1,2 35 62406 58338 66475 6,5 1,4 40 49737 46147 53328 7,2 1,6 45 39863 36716 43011 7,9 1,8 50 32123 29376 34871 8,6 2,0 55 26022 23631 28413 9,2 2,2 60 21186 19109 23264 9,8 2,4 65 17334 15530 19137 10,4 2,6 70 14249 12683 15814 11,0 2,8 75 11767 10407 13126 11,6 3,1 80 9760 8579 10941 12,1 3,3 85 8130 7103 9157 12,6 3,5 90 6800 5906 7695 13,2 3,7 95 5711 4931 6491 13,7 4,0 100 4815 4134 5496 14,2 4,2 105 4075 3479 4671 14,6 4,4 110 3461 2938 3983 15,1 4,7 115 2950 2491 3409 15,5 4,9 120 2523 2120 2927 16,0 5,2 125 2165 1810 2521 16,4 5,4
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 3/7 reliability tests of smd ntc thermistors are made according to iec 60068. the parts are mounted on standardized pcb in accordance with iec 60539-1. test standard test conditions ? r 25 / r 25 (typical) remarks storage in dry heat iec 60068-2-2 (=jis c 0021) storage at upper category temperature t: 125c t: 1000h < 2% storage in damp heat, steady state iec 60068-2-3 (=jis c 0022) temperature of air: 40c relative humidity of air: 93% duration: 56days < 2% no visible damage rapid temperature cycling iec 60068-2-14 (=jis c 0025) lower test temperature: -55c upper test temperature: 125c number of cycles: 100 < 2% endurance at p max - p max =210mw duration: 1000h < 2% solderability iec 60068-2-58 (=jis c 0054) solderability: 215c/3s 235c/2s resistance to soldering heat: 260c/10s 95% of termination wetted resistance drift after soldering - reflow soldering profile wave soldering profile < 1%
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 4/7 mounting instructions 1. termination ni-barrier termination (ag/ni/sn) 2. recommended geometry of solder pads size a [mm] b [mm] c [mm] d [mm] 0805 1.3 1.2 1.0 3.4 3. requirements for solderability - wettability test in accordance with iec 60068-2-58 (= jis c 0054) : preconditioning: immersion into flux f-sw 32. evaluation criteria: wetting of soldering areas 95%. pb-containing solder: sn(60)pb(40) bath temperature (c): 215 3 dwell time (s): 3 0.3 pb-free solder: sn(95.1-96.0)ag(3.0-4.0)cu(0.5-0.9) bath temperature (c): 245 5 dwell time (s): 3 0.3 - soldering heat resistance test in accordance with iec 60068-2-58 (= jis c 0054) : preconditioning: immersion into flux f-sw 32. evaluation criteria: leaching of side edges 1/3. solder: sn(60)pb(40), sn(95.1-96.0)ag(3.0-4.0)cu(0.5-0.9) bath temperature (c): 260 5 dwell time (s): 10 1 a a d c b b inner electrode base layer - silver diffusion barrier - nickel outer layer - tin
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 5/7 4. recommended soldering profiles reflow soldering profile: (according to cecc 00802) temperature characteristics at component terminals during reflow soldering (two cycles are permitted). wave soldering profile: temperature characteristics at component termi nals during wave soldering can be recommended once in general. 5. storage conditions solderability is guaranteed for 12 months from date of delivery for types with ni-barrier termination, provided that the components are stored in the original packages. storage temperature: -25 ... +45c relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible.
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 6/7 taping and packing taping: tape and reel packing comply with specifications of iec 60286-3 blister tape dimensions and tolerances: definition symbol dimension (mm) tol. (mm) size 0805 compartment width x compartments length a 0 x b 0 1.6 x 2.4 0.2 compartment height k 0 1.4 max. overall thickness t 2 2.5 max. t 0.3 max. sprocket hole diameter d 0 1.5 +0.1/-0 compartment hole diameter d 1 1.0 min. sprocket hole pitch p 0 4.0 0.1 1) distance centre hole to centre compartment p 2 2.0 0.05 pitch of the component compartments p 1 4.0 0.1 tape width w 8.0 0.3 distance edge to centre of hole e 1.75 0.1 distance centre hole to centre compartment f 3.5 0.05 distance edge to centre compartment g 0.75 min. 1) 0.2 mm over 10 sprocket holes. part orientation in tape pocket p 1 1 d a a 0 a g f e w p d p 0 2 0 0 k t 2 b 0 section a-a direction of unreelin g equivalent terminations because of unipolar component
smd ntc thermistor smd ntc thermistor with ni-ba rrier termination B57431V2104J062 data sheet issue date 08.12.2005 issue a publisher kb s pe page 7/7 reel packing: reel material: ps. tape material: blister tape break force: min. 10n top cover tape peel force: 0.1 - 0.65n at a peel speed of 300 mm/min, angle between top cover tape and the direction of feed during peel off: 165 -180. top cover tape strength: min. 10n length of tape: leader section: additional top cover tape, length min 400 mm, before component section (including carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities). trailer section: length min. 40 mm. empty part cavities at leader and trailer section on tape are sealed with top cover tape. cavity play: each part rests in the cavity so that the angle between the part centreline and the cavity centreline is no more than 20. weight of loaded reel: max. 1500 g packing units: 3000pcs. package 8 mm tape definition symbol dim. (mm) tol. (mm) reel diameter a 180 -3/+0 reel width (inside) w 1 8.4 +1.5/-0 reel width (outside) w 2 14.4 max. ? epcos ag 2005. reproduction, publicat ion and dissemination of this data sheet, enclosures hereto and the information contained therein without epcos' pr ior express consent is prohibited. purchase orders are subject to the general conditions for t he supply of products and servic es of the electrical and electronics industry recommended by the zvei (german elec trical and electronic manufacturers' association), unless otherwise agreed.
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